LBNL-2016: Instrumentation

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Notes from Wednesday session (taken by NWH):

Kent Irwin: Detector interfaces and questions

Antenna to room temperature readout interconnects: How many and where are they? Complexity cost associated with interconnects.


1. 1-300 K architecture 2. Mux element - volume, mass, power dissipation 3. Pixel to mux interconnects, complexity -- do we need R & D on bump bonds, etc.

Need people to explore the following mux/detector options:

1. TDM+ 2. FDM+ 3. MKID's 4. RF TES's

microwave SQUIDs
parametric amps
JJ mux

Need to quantify costs, power flow, complexity, power dissipation.

Adrian: Costs need to be broken down into: A. Startup cost and risk B. Production cost and risk C. Integration cost D. Testing cost

Kent: There is a cost per production pixel that is way to low, because it means you spent way too much in R&D to bring down cost.

We should figure out what we know.

Mike N.: Should we discuss timelines? Need to demonstrate key performance characteristics.

Jamie pointed out yesterday hat if there are particular technologies that we should push right away, we should write white paper and proceed to take advantage of this opportunity.

Collaboration process discussion:

Is there communication with DOE that needs to happen during prelim R&D? John C.: Timeline 2019, 2020 CD1, have to make all technology selections by then. Natalie R.: Some details on readout, etc, can be worked out between CD1 and CD2.

Decision: We need to target R&D done and make technology decision by 2019.

Need to give DOE a heads up on budget before then.

Adrian: Could identify and pursue high/med/low risk paths in parallel.

Action items:

  • Organize people and timeline for studies (Kent, Zeesh, Kam, Steve, Sarah, Toki, Darcy, Akito, Amber, Brad). Date: will report to cosmic visions group and wiki by 4/16/16.

Charles: Costs should include requirements imposed on the rest of the system (e.g., magnetic shielding).